| PART |
Description |
Maker |
| S71NS032JA0BJWRT0 S71NS032J80BJWRA |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA56
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| AM70PDL127CDH66IT AM70PDL127CDH85IS AM70PDL127CDH8 |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) 堆叠式多芯片封装（MCP / XIP）的快闪记忆体，数据存储的MirrorBit闪存和移动存储芯片（XIP）的
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) SPECIALTY MEMORY CIRCUIT, PBGA93
2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS 2 × 64兆位米16位）的CMOS 3.0伏特，只有页面模式闪存数据存28兆位米16位）的CMOS
|
Spansion Inc.
Spansion, Inc.
|
| MB84VD23381FJ MB84VD23381FJ-80PBS |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & FCRAM
|
Fujitsu Component Limited.
Fujitsu Limited
|
| AM49DL3208G |
Stacked Multi-Chip Package (MCP) Flash Memory and pSRAM
|
Advanced Micro Devices
|
| AM42BDS6408G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| AM42DL640AH |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| AM49DL640BH |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| S71WS-NX0 S71WS512ND0BFWA23 S71WS512NC0BFWA23 S71W |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
SPANSION LLC
|
| MB84VD2119XEM-70 MB84VD21181EM-70PBS MB84VD21182EM |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS
|
SPANSION[SPANSION]
|
| AM45DL3208GT70IS AM45DL3208GT85IS AM45DL3208GT70IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices, Inc.
ADVANCED MICRO DEVICES INC
|
| DS42587 AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
